The focus of the Micromechanics Laboratory is on understanding the mechanical behavior of different materials at different scales through multi-scale modeling and experiments. In particular, electronic and bio-materials are of interest. We constantly work on developing new techniques of testing and characterization at small scales. Smart micro devices are also another focus of the Micromechanics Laboratory. Using functional and electroactive materials we develop technologies that are used to characterize different types of materials.

Graduate Research Positions Available

Several research positions are available for current and potential graduate students to work on cutting edge exciting research projects funded by NASA and NSF with Dr. Leila Ladani at Mechanical Engineering Department of the University of Alabama. Benefits include tuition coverage, health insurance and competitive pay for the duration of the project.  For more information click here.

• Electron Beam Additive Fabrication Technology for Rapid Manufacturing of Space Vehicle Hardware: The objectives of this research is to Evaluate mechanical performance of EBAF parts for environmental condition of space applications using multi-scale modeling and experiment. 

• Anisotropic deformation and damage mechanisms in Al-Mg bi-modal grain size alloy: This research focuses on exploring in-elastic deformation and damage mechanisms of Al-Mg bi-modal grain size alloys. This is achieved through mechanical testing and microstructural finite element analysis.

• Failure mechanisms and reliability assessment for 3-D IC packages using Physics of Failure (PoF) principles: The focus of this project is finding viable solutions for reliable micro-interconnects for 3-dimensional integrated circuits.

• Micro-scale solid-liquid inter-diffusion (SoLID) bonds for 3-Dimensional integrated circuits: (3D IC) This project aims to scientifically investigate the kinetics of bond formation, and examine deformation, fatigue and failure mechanisms of solid-liquid-inter-diffusion (SoLID) bonds with anisotropic behavior and comparable microstructural (grain) and structural (bond) scales.

• Integrated micro-electro-mechanical system for bio-material probing and testing: The objective of this research is to scientifically investigate feasibility of a new transformative and innovative idea of dual-probing, loading and mechanical characterization of micro scale tissue samples and to examine the applicability of the technique in detecting the change in mechanical properties of malignant and cancerous tissues.

• Fatigue damage in T-38 aileron lever: Crack initiation and propagation due to cyclic mechanical fatigue damage in the T-38 aileron lever is modeled using a continuum damage modeling approach in conjunction with a “successive initiation” technique. “Successive initiation” is a continuum based damage propagation methodology that is based on updating the state of damage in material and accumulating damage in individual elements according to their stress-life history.  This approach successfully predicts the location of crack initiation, propagation path and propagation rate. 

• Micro structural finite element of fatigue crack initiation and propagation in bi-modal grain size alloys: A fatigue crack propagation model was developed for bi-modal grain size alloys and damage model constants for bi-modal grain size aluminum were generated. The model was then used in 2D and 3D microstructural finite element models to model crack initiation and propagation. Grains with different properties were modeled using global-local modeling approach.

• Reliability of RF N/MEMS for high power application: This research  focused on modeling and simulation of RF M/NEMS contact switches and to determine the critical factors that may affect the surface degradation thereby causing failure due to stiction or increased contact resistance.

• Development of a crack sensor for high temperature applications: Crack sensors are used to detect crack initiation and propagation in different structures due to different types of environmental loading. The proposed research plan is for initiation and development of a crack sensor for high temperature applications, such as reactors and furnaces in energy conversion systems where available techniques are not feasible. The focus was on micro scale application which resulted in design of a micro scale sensor for evaluating the state of damage in micro scale materials.

• Effects of manufacturing variables on quality and durability of Pb-Free solder interconnects: In summary there were two objectives to this study; first to investigate the effect of manufacturing variabilities on generation of defects and effect of defects, in particular voids, on thermo-mechanical durability of Pb-free solder joints and second to investigate the impact of design variables on generation of defects and impact of defects, in particular voids, on thermal performance of the micro joints. Both experiment and finite element modeling and simulation were carried out.

• Development of hybrid level screening methodology: The main objectives of this project was to assess the effectiveness of burn-in for hybrid microcircuits and feasibility of reducing bur

  n-in time, review influence of assembly defects on durability of Sn/Pb interconnects and set up a test plan to study the effect of manufacturing variabilities on durability of lead-free solder interconnects. The study was conducted on hybrid pacemaker packages.